DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. https://www.deepmaterialcn.com/epoxy-based-chip-underfill.html
https://www.linkedin.com/in/underfilladhesive/
https://www.pinterest.com/underfilladhesive
https://forum.enscape3d.com/wcf/index.php?user/26583-underfilladhesive/#about
https://triberr.com//underfilladhesive1
https://hypothes.is/users/underfilladhesive1
https://www.pozible.com/profile/epoxy-chip-underfill
https://www.codechef.com/users/underfilladhe1
https://influence.co/underfilladhesive